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PCB
US$0.10-1.50 / Piece
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What is One Step Service Electronic Components Bom List PCBA Assembly PCB Production

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$1.50

100-499 Pieces US$1.00

500-999 Pieces US$0.50

1,000+ Pieces US$0.10

Sepcifications

  • Type Rigid Circuit Board
  • Flame Retardant Properties V0
  • Dielectric FR-4
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Processing Technology Electrolytic Foil
  • Application Consumer Electronics
  • Mechanical Rigid Rigid
  • Material Paper Phenolic Copper Foil Substrate
  • Brand Kevis
  • Transport Package Individual Packaging
  • Specification 20*18*1
  • Origin Guangzhou
  • Layer 1-64 Layers
  • Board Thickness 0.2mm-7.0mm
  • Min. Line Width 0.075mm/0.075mm(3mil/3mil)
  • Min. Hole Size 0.15mm
  • Surface Treatment Flash Gold, Enig, Enepig, Gold Fingers Hard Gold
  • Solder Mask Color Green, Blue, Yellow, White, Black

Product Description

One step service electronic components Bom list PCBA Assembly PCB Production About Us Our Advantage Factory 18+Years Pcb/Pcba Manufacturing Experience,4500 Workshop Areas,10 Automatic Production Lines. Advanced equipment and strong productivity make each PCB board more accurate and ...

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PCB Comparison
Transaction Info
Price US$0.10-1.50 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$1.99 / pieces
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 pieces
Payment Terms T/T T/T, Western Union T/T, Western Union T/T, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Management System Certification ISO14001, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others -
Trade Capacity
Export Markets North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic North America
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM, OEM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Brand: Hongyu;
Board Thickness: 1.5mm;
Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 70μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Brand: Hongyu;
Board Thickness: 1.5mm;
Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 70μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Brand: Hongyu;
Board Thickness: 1.5mm;
Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 70μm;
Tg: 150°C;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: AIN;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Processing Technology: Electrolytic Foil;
Application: Car Lighting;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Xly;
Supplier Name

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Xinlongye Electronic Technology Co., Ltd

Gold Member Audited Supplier

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