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FPC
US$0.10-1.00 / Piece
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What is OEM PCB Professional Custom Circuit Board Flex Board Rigid-Flex PCB Fabrication Manufacture FPC

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$1.00

100-499 Pieces US$0.50

500+ Pieces US$0.10

Sepcifications

  • Structure Multilayer FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
  • Conductive Adhesive Conductive Silver Paste
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Kevis
  • Transport Package Individual Packaging
  • Specification 25*20*1
  • Trademark KAIVESIN
  • Origin Guangzhou
  • Products Name PCBA Assembly PCB Electronic Motherboard Board
  • Layer Single / Double Sided / Multilayer
  • Service PCB/PCBA/PCB Assembly/Electronic Parts
  • Other Service Layout Design,Engineering Support,Testing
  • Specialised Medical,Industrial,Communication,Controlboard,LED
  • PCBA QC X-ray, Aoi Test, Function Test(100% Test),40X Om
  • Certificate ISO9001,ISO14001,ISO13485,Ts-16949,etc
  • Surface Finishing HASL, Enig, OSP, Lmmersion Au, AG,Sn
  • Copper Thickness 0.5oz/1oz/2oz/3oz/4oz
  • Min.Hole Size 0.1mm (4 Mil)
  • Board Thickness 0.2mm-7mm
  • Min.Line Spacing 0.1mm (4 Mil)
  • Solder Color Green, Red, White, Black,Yellow,Blue
  • SMT Assembly Line 10 Lines
  • Delivery PCB: 1-5 Days; PCB Assembly: 1-10 Days

Product Description

Title OEM PCB Professional Custom Circuit Board Flex Board Rigid-flex PCB Fabrication Manufacture FPC Product Parameters ltem Value Product name Kevis Manufacturer OEM PCB Circuit Board SMT PCB Assembly Model Number Printed Circuit Board , Development Board , Motherboard Type PCB , PCBA ...

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FPC Comparison
Transaction Info
Price US$0.10-1.00 / Piece US$5.00-10.00 / Piece US$1.00-10.00 / Piece US$1.00-10.00 / Piece US$0.01-20.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T T/T, PayPal, Western Union, Small-amount payment, VTB T/T, PayPal, Western Union, Small-amount payment, VTB T/T, PayPal, Western Union, Small-amount payment, VTB LC, T/T, PayPal, Western Union
Quality Control
Product Certification ISO9001,ISO14001,ISO13485,Ts-16949,etc - - - -
Management System Certification ISO14001, Others - - - -
Trade Capacity
Export Markets North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, South America, Western Europe North America, South America, Western Europe North America, South America, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard Board;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi+Pi/Fr4 for Stiffener;
Insulation Materials: Organic Resin;
Brand: Exceeding;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Delivery: 5days;
Keyword: FPC;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi+Pi/Fr4 for Stiffener;
Insulation Materials: Organic Resin;
Brand: Exceeding;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Delivery: 5days;
Keyword: FPC;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi+Pi/Fr4 for Stiffener;
Insulation Materials: Organic Resin;
Brand: Exceeding;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Delivery: 5days;
Keyword: FPC;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Medical;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Supplier Name

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

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