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PCB
US$0.10-1.50 / Piece
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What is Multi-Layers PCB Circuit Board PCB Prototype PCBA Assembly PCBA Manufacturer

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$1.50

100-499 Pieces US$1.00

500-999 Pieces US$0.50

1,000+ Pieces US$0.10

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Kevis
  • Transport Package Individual Packaging
  • Specification 20*18*1
  • Origin Guangzhou
  • Layer 1-64 Layers
  • Board Thickness 0.2mm-7.0mm
  • Min. Line Width 0.075mm/0.075mm(3mil/3mil)
  • Min. Hole Size 0.15mm
  • Surface Treatment Flash Gold ,Enig, Enepig, Gold Fingers Hard Gold,
  • Solder Mask Color Green, Blue , Yellow , White , Black

Product Description

Multi-Layers PCB Circuit Board PCB Prototype PCBA Assembly PCBA Manufacturer About Us Our Advantage Factory 18+Years Pcb/Pcba Manufacturing Experience,4500 Workshop Areas,10 Automatic Production Lines. Advanced equipment and strong productivity make each PCB board more accurate and ...

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PCB Comparison
Transaction Info
Price US$0.10-1.50 / Piece US$5.00-25.00 / Piece US$5.00-25.00 / Piece US$1.90 / Piece US$0.90-1.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union T/T, PayPal, Western Union
Quality Control
Management System Certification ISO14001, Others - - - -
Trade Capacity
Export Markets North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Australia, Domestic North America, Europe, Australia, Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM Own Brand, OEM Own Brand, OEM - -
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold ,Enig, Enepig, Gold Fingers Hard Gold,;
Solder Mask Color: Green, Blue , Yellow , White , Black;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Jc;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Jc;
Type: Rigid Circuit Board;
Dielectric: FR-3;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
for Consumption Electronic Product: 220mm*150mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Supplier Name

Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jia Cheng Electric Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jia Cheng Electric Co., Ltd.

Diamond Member Audited Supplier

R-CREATION Technology Co., Ltd.

Gold Member Audited Supplier

R-CREATION Technology Co., Ltd.

Gold Member Audited Supplier

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