| Specification |
Type: IC Substrate;
Dielectric: Bt;
Material: Bt;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Bt;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: IC Substrate Board Bt Substrate PCB;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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Type: Rigid Circuit Board;
Dielectric: Rogers RO4533 (Ceramic-Filled, Glass-Reinforced Hy;
Material: Rogers RO4533 Laminate;
Application: Cellular Base Station Antennas;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: Rogers RO4533 Laminate;
Insulation Materials: Ceramic-Filled, Glass-Reinforced Hydrocarbon Compo;
Brand: Rogers;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Kb;
Cooper Thickness: 1oz;
Surface Finishing: Lead Free HASL;
Solder Mask Color: Green;
Silkscreen: White;
Min Line Width/Space: 0.075mm/0.075mm;
Min Hole Diameter: 0.15mm;
Finished Board Thickness: 1.6 mm;
Layer: 2layer;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: N/a;
Surface Finishing: Immersion Gold;
Thickess: 1.8mm;
Soldermask: Black;
Overlay: Orange;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Test: Flying Probe and Fixture;
Solder Mask: Blue;
Certificates: UL, RoHS, SGS, ISO9001;
Board Thickness: 0.8mm / 1.6mm / 1.8mm / Custom;
Custom: OEM / ODM;
Copper: 2oz / 70um;
Surface Finish: Enig 2u'';
Layers: 1-20 Layers;
Legend: White;
Specialities: Gold Finger;
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