| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Thickness: 0.21--7mm;
Min. Hole Size: 0.10mm;
Min. Line Width: 3mil;
Min. Line Spacing: 3mil;
Surface Finishing: HASL;
Soldermask: Green,Yellow,Black,White,Red;
Silkscreen: White,Yellow,Black;
Special Technological Requirement: Blind & Buried Vias and High Thickness Copper;
Needed: Gerber File,Bom List,Sample If Better;
Board Copy Service: Yes;
PCB Factory: Yes;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: CEM-5;
Customized: Customized;
Condition: New;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Testing Service: Fly-Probe, 100% Aoi Testing, 100%;
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Metal Coating: Silver;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: CEM-3;
Customized: Customized;
Condition: New;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Testing Service: Fly-Probe, 100% Aoi Testing, 100%;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Model Number: Hw-Xc508 Microwave Module;
Sensor Object: Microwave Induction Moving Object;
Input Voltage: DC-12V;
Working Current: <20mA;
Output Voltage: H/5V;
Induction Method: Doppler Motion Detection;
Induction Time: 2s-120s(3326);
Induction Distance: 0.5m-12m;
Transmit Power: <0.3W;
Angle: 90-360;
Photosensitive: 5p-1/ 3p-1;
Dimensions: 23*22*13mm;
Color: White;
Function: Detect Movements;
Feature: High Light Efficient;
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