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PCBA PCB Assembly
US$170.00-215.00 / Set
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What is PCB PCBA OEM ODM DC Inverter Heat Pump Control Board Printed Circuit Board Assembly PCBA

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

2 Sets US$170.00-215.00 / Set

Sepcifications

  • Metal Coating Copper
  • Mode of Production SMT
  • Layers Double-Layer
  • Base Material FR-4
  • Certification RoHS, ISO
  • Customized Customized
  • Condition New
  • Transport Package 1.Protect Product with Polyfoam and Multi Layer PA
  • Specification Mounting size: 267*200*125mm
  • Trademark ELECHICO
  • Origin Foshan, China
  • Produuct Name Inverter Heat Pump Controller
  • Application Commercial Heat Pump Machine
  • Power Supply 220&Plusmn, 50/60Hz
  • Sensor Type Ntc(5K, 50K)
  • Controlling Range -20°C~60°C
  • Control Mode Heating,Cooling, Hot Water
  • Max Input Power 3.5-4.5kw
  • Max Input Current 16-21A
  • Inverter Frequency Range 15Hz-120Hz
  • Carrier Frequency 5kHz
  • Pfc Valve 0.90-0.99

Product Description

Product Description CCHW008 Multifunctional Hot Water Heating Cooling DC Inverter Heat Pump Controller PCBACCHW008 Series Multifunctional Inverter heat pump controller is designed for controlling commercial heating or cooling heat pump with DC inverter compressor driver control board. Inverter ...

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PCBA PCB Assembly Comparison
Transaction Info
Price US$170.00-215.00 / Set US$6.20 / Piece US$6.20 / Piece US$6.20 / Piece US$6.20 / Piece
Min Order 2 Sets 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union, Small-amount payment, D/P LC, T/T, PayPal, Western Union, Small-amount payment, D/P LC, T/T, PayPal, Western Union, Small-amount payment, D/P LC, T/T, PayPal, Western Union, Small-amount payment, D/P
Quality Control
Product Certification RoHS, ISO RoHS, CCC, ISO, UL,IATF16949 RoHS, CCC, ISO, UL,IATF16949 RoHS, CCC, ISO, UL,IATF16949 RoHS, CCC, ISO, UL,IATF16949
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Produuct Name: Inverter Heat Pump Controller;
Application: Commercial Heat Pump Machine;
Power Supply: 220&Plusmn, 50/60Hz;
Sensor Type: Ntc(5K, 50K);
Controlling Range: -20°C~60°C;
Control Mode: Heating,Cooling, Hot Water;
Max Input Power: 3.5-4.5kw;
Max Input Current: 16-21A;
Inverter Frequency Range: 15Hz-120Hz;
Carrier Frequency: 5kHz;
Pfc Valve: 0.90-0.99;
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Supplier Name

Guangdong Chico Future Technology Group Inc.

Diamond Member Audited Supplier

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier

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