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OEM Bom Gerber Files PC Motherboard Sample One Stop Service Industry Solutions Printed Circuit Board Assembly PCBA Multilayer PCB

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-98 Pieces US$0.88

99-999 Pieces US$0.78

1,000+ Pieces US$0.58

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Epoxy Resin
  • Brand Customized
  • Transport Package Vacuum Packing + Carton Box + ESD Protection
  • Specification Customized Size
  • Trademark Customizable
  • Origin China

Product Description

Tailored PCB Design with Customer-Specific Test Point Placement Professional PCB OEM with Expert Quality Control Specification Innovative Design Technical Highlights Feature Specification Bluetooth Version 5.3 (20m range) Driver Type Graphene-coated MEMS speakers Water Resistance IP67 (heavy ...

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PC Motherboard Comparison
Transaction Info
Price US$0.58-0.88 / Piece US$3.00-10.00 / Piece US$3.00-10.00 / Piece US$3.00-10.00 / Piece US$3.00-10.00 / Piece
Min Order 10 Pieces 5 Pieces 5 Pieces 5 Pieces 5 Pieces
Payment Terms LC, T/T, D/P LC, T/T, PayPal LC, T/T, PayPal LC, T/T, PayPal LC, T/T, PayPal
Quality Control
Management System Certification ISO9001:2015 - - - -
Trade Capacity
Export Markets Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model ODM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable;
Layer: 1-32;
Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
Max Production Size: 600*800mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable;
Layer: 1-32;
Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
Max Production Size: 600*800mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable;
Layer: 1-32;
Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
Max Production Size: 600*800mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable;
Layer: 1-32;
Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
Max Production Size: 600*800mm;
Supplier Name

Huzhou Ganchuang Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Jumptop Trading Co Ltd

Gold Member Audited Supplier

Shanghai Jumptop Trading Co Ltd

Gold Member Audited Supplier

Shanghai Jumptop Trading Co Ltd

Gold Member Audited Supplier

Shanghai Jumptop Trading Co Ltd

Gold Member Audited Supplier

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