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Digital Modulator
US$8.10 / PCS
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What is FSAN H. 265 2.0/3.0MP Low Illumination HD Network IP Camera Module

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

500 PCS US$8.10 / PCS

Sepcifications

  • Type Rigid Circuit Board
  • Processing Technology Electrolytic Foil
  • Application IP Camera Modlue
  • Mechanical Rigid Rigid
  • Transport Package Cartons
  • Origin Made in China

Product Description

FSAN H.265 2.0/3.0MP Low Illumination HD Network IP Camera Module Product Description Resolution 2mp/3mp (1920x1080@25fps@2mp; 2304x1296@20fps@3mp) Built-in Humanoid Detection algorithm; Detection frame 5fps, detect 5 people at the same time; Low consumption, low code stream, low delay; ...

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Digital Modulator Comparison
Transaction Info
Price US$8.10 / PCS US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
Min Order 500 PCS 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union
Quality Control
Management System Certification - ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets North America, Europe, East Asia(Japan/ South Korea) Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Processing Technology: Electrolytic Foil;
Application: IP Camera Modlue;
Mechanical Rigid: Rigid;
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Brand: Hongyu;
Board Thickness: 1.5mm;
Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 70μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Brand: Hongyu;
Board Thickness: 1.5mm;
Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 70μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Brand: Hongyu;
Board Thickness: 1.5mm;
Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 70μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Brand: Hongyu;
Board Thickness: 1.5mm;
Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 70μm;
Tg: 150°C;
Supplier Name

Shenzhen FSAN Intelligent Technology Co., Ltd.

Gold Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

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