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Bluetooth HDI PCB Circuit Board with Competitive Price

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 piece US$0.93

100+ piece US$0.88

Sepcifications

  • Structure Double-Sided Rigid PCB
  • Dielectric FR-3
  • Material Phenolic Paper Laminate
  • Application Computer
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Semi-Additive Process
  • Base Material Fr4
  • Insulation Materials Organic Resin
  • Brand Fastline
  • Transport Package Vacuum Packing
  • Specification IP class -2
  • Trademark Fastline
  • Origin Shenzhen, China
  • Board Material Fr4
  • Layers 1 to 30 Layers
  • Board Thickness 1.6mm
  • Copper Thickness 1oz
  • Solder Mask Green
  • Silk Screen White
  • Surface Treatment HASL Lead Free
  • Test 100%
  • Lead Time 6-8 Working Days
  • Min. Line Width 0.075mm

Product Description

Bluetooth HDI PCB Circuit Board with competitive Price Product Description Fastline PCB's aim Customer Satisfaction is Always Our First Priority! *Quality Policy *Top Quality and high efficiency ...

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HDI PCB Comparison
Transaction Info
Price US$0.88-0.93 / piece US$1.00 / Piece US$1.10-1.70 / Piece US$2.80-3.60 / Piece US$2.00-3.50 / Piece
Min Order 1 piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Double-Sided Rigid PCB;
Dielectric: FR-3;
Material: Phenolic Paper Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
Structure: Rigid-Flex;
Dielectric: Polyimide&Fr4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Polyimide&Fr4;
Insulation Materials: Epoxy Resin;
Brand: UC;
Layer: 20;
Thickness: 3.0mm;
Min Hole: 0.45mm;
Surface: Enig;
Structure: Rigid-Flex;
Dielectric: Polyimide&Fr4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Polyimide&Fr4;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Layer: 8;
Thickness: 2.0mm;
Hole: 03mm;
Surface: Enig;
Structure: Rigid-Flex;
Dielectric: Polyimide&Fr4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Polyimide&Fr4;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Layer: 4;
Thickness: 0.55mm;
Hole: 0.3mm;
Surface: Enig;
Structure: Rigid-Flex;
Dielectric: Polyimide&Fr4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Polyimide&Fr4;
Insulation Materials: Epoxy Resin;
Brand: UC;
Layer: 4;
Thickness: 0.4mm;
Surface: Enig;
Space: 0.12mm;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

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