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Ceramic PCB
US$0.23 / Piece
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What is Ceramic PCB, Shenzhen Ceramic PCB Manufacturer with Al2O3 Ain Base Material

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.23 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Flame Retardant Properties V0
  • Dielectric Alumina
  • Base Material Al2O3
  • Insulation Materials Metal Composite Materials
  • Processing Technology Electrolytic Foil
  • Application LED Lighting
  • Mechanical Rigid Rigid
  • Material Ceramics
  • Brand FL
  • Transport Package Vacuum+Carton Packing
  • Specification 20MM*30MM
  • Trademark FL
  • Origin China
  • Board Layer 1 L
  • Copper Thickness 1 Oz
  • Board Thickness 0.8mm
  • Solder Mask White
  • Silkscreen Black
  • Surface Finsihed Enig
  • Test 100%Test
  • MOQ None
  • Lead Time 10-12 Days

Product Description

Product Description Alumina Ceramics Technical Parameter: Alumina Ceramics Technical Parameter Alumina Content 80-85% 90-96% > 99.5% 99% General Application Lower Cost Electrical&Mechanical High Strength, Wear Resistant, Electronic, Insulating, ...

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Ceramic PCB Comparison
Transaction Info
Price US$0.23 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union
Quality Control
Management System Certification - ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
Annual Export Revenue - - - - -
Business Model - Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Alumina;
Base Material: Al2O3;
Insulation Materials: Metal Composite Materials;
Processing Technology: Electrolytic Foil;
Application: LED Lighting;
Mechanical Rigid: Rigid;
Material: Ceramics;
Brand: FL;
Board Layer: 1 L;
Copper Thickness: 1 Oz;
Board Thickness: 0.8mm;
Solder Mask: White;
Silkscreen: Black;
Surface Finsihed: Enig;
Test: 100%Test;
MOQ: None;
Lead Time: 10-12 Days;
Type: Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 2.3mm;
Metal Core PCB: Aluminum 5052 Core (1.5mm);
Thermal Conductivity: 3.2W/M·K (Dielectric Layer);
Copper Foil: 175μm;
Tg: 150°C;
Type: Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 2.3mm;
Metal Core PCB: Aluminum 5052 Core (1.5mm);
Thermal Conductivity: 3.2W/M·K (Dielectric Layer);
Copper Foil: 175μm;
Tg: 150°C;
Type: Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 2.3mm;
Metal Core PCB: Aluminum 5052 Core (1.5mm);
Thermal Conductivity: 3.2W/M·K (Dielectric Layer);
Copper Foil: 175μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Brand: Hongyu;
Board Thickness: 1.7mm;
Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
Thermal Conductivity: 3.2W/M·K (Dielectric Layer);
Copper Foil: 170μm;
Tg: 150°C;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

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