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Best Quality Shenzhen Rigid-Flex PCB Board PCB Assembly Fabrication for Power Bank

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$0.3336

10-99 Pieces US$0.333

100-999 Pieces US$0.33

1,000+ Pieces US$0.30

Sepcifications

  • Structure Multilayer FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
  • Conductive Adhesive Anisotropic Conductive Adhesive
  • Flame Retardant Properties V2
  • Processing Technology Electrolytic Foil
  • Base Material Polyimide & Fr4
  • Insulation Materials Epoxy Resin
  • Brand Fastline
  • Transport Package Vacuum Packing
  • Specification Rohs, UL
  • Trademark Fastline
  • Origin Shenzhen
  • Layer 2
  • Solder Mask Green + Yellow Cover Film
  • Board Thickess 1.6mm Rigid and 0.1mm Flex
  • Copper Thickness 1oz
  • Silk Screen White
  • Test 100%
  • Small Order Accepter
  • Board Material Fr4+ Polymide
  • PCB Type Rigd-Flex PCB
  • Product Type Customized

Product Description

1 Layer to 26 Layer Printed Circuit Board for Electronic Products Fastline could meet all your PCB manufacturing needs, including High multilayer PCB, Aluminum based PCB, HDI PCB, Rigid-flex PCB, heavy copper PCB, and PCB assembly as well. Our products are widely applied in telecom, industrial ...

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PCBA Comparison
Transaction Info
Price US$0.30-0.3336 / Piece US$0.10 / Piece US$0.10 / Piece US$0.10 / Piece US$0.10 / Piece
Min Order 1 Piece 1,000 Pieces 1,000 Pieces 1,000 Pieces 1,000 Pieces
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide & Fr4;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Layer: 2;
Solder Mask: Green + Yellow Cover Film;
Board Thickess: 1.6mm Rigid and 0.1mm Flex;
Copper Thickness: 1oz;
Silk Screen: White;
Test: 100%;
Small Order: Accepter;
Board Material: Fr4+ Polymide;
PCB Type: Rigd-Flex PCB;
Product Type: Customized;
Structure: Double-Sided FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Eshine;
Structure: Double-Sided FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Eshine;
Structure: Double-Sided FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Eshine;
Structure: Double-Sided FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Eshine;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

ESHINE CORP LIMITED

Gold Member

ESHINE CORP LIMITED

Gold Member

ESHINE CORP LIMITED

Gold Member

ESHINE CORP LIMITED

Gold Member

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