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16 Layer HDI Multilayer PCB Board
US$1.08-5.26 / Piece
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What is High Frequency 16 Layer HDI Multilayer PCB Board for Smart Electronics Fast Turnkey OEM/ODM PCB Assembly & Manufacturing Factory

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

50-99 Pieces US$5.26

100-999 Pieces US$3.25

1,000+ Pieces US$1.08

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Enig
  • Base Material Fr4
  • Insulation Materials Epoxy Resin
  • Brand Fastline
  • Transport Package Vacuum Packing
  • Specification Certificates: UL, ROHS
  • Trademark FL
  • Origin China
  • Board Material Fr-4 (Tg 135 )
  • Board Thickness 1.6 mm
  • Copper Thickness 1 Oz (35um)
  • Surface Treatment HASL Lead Free
  • Solder Mask Green
  • Silk Screen White
  • Flying Probe Test Yes
  • Supplier Manufacturer
  • Layers 1-50L
  • Thicknees 1oz/2oz
  • Test 100% Test
  • Thickness 1 Oz/2oz
  • Certification UL/CE/CCC/ISO9001
  • Lead Time 6-15 Days
  • Service Fast-Prototype

Product Description

High Frequency 16 Layer HDI Multilayer PCB Board for Smart Electronics | Fast Turnkey OEM/ODM PCB Assembly &Manufacturing Factory Fastline Circuits Co., Limited, a leading PCB/PCBA contract manufacturer in China since 2006, specializes in delivering tailored manufacturing solutions to global ...

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16 Layer HDI Multilayer PCB Board Comparison
Transaction Info
Price US$1.08-5.26 / Piece US$0.45-10.00 / Piece US$0.03-10.00 / Piece US$0.03-10.00 / Piece US$0.38-13.00 / Piece
Min Order 50 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union
Quality Control
Product Certification UL/CE/CCC/ISO9001 - - - -
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - - - -
Business Model - ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Board Material: Fr-4 (Tg 135 );
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz (35um);
Surface Treatment: HASL Lead Free;
Solder Mask: Green;
Silk Screen: White;
Flying Probe Test: Yes;
Supplier: Manufacturer;
Layers: 1-50L;
Thicknees: 1oz/2oz;
Test: 100% Test;
Thickness: 1 Oz/2oz;
Lead Time: 6-15 Days;
Service: Fast-Prototype;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: New Chip;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series,...;
Material for PCB: Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series,...;
Material for PCB: Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: New Chip;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

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