| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Lead Time: 5-7 Days;
Packing Type: Carton + Vacuum;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Board Layer: 1 to 20 Layers;
Silk Screen Color: White;
Solder Mask: Green, Red, Blue, Black;
Surface Treatment: HASL Lead Free;
Material Type: Fr4;
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Type: Aluminum PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Smart;
LED PCB: LED PCB Board;
Color: Green,Yellow Black,White,Red,Blue;
Copper Thickness: 0.5oz,1.0oz,2oz,3oz;
Board Size: Custom;
Board Thickness: 0.4mm-3.2mm;
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Type: Aluminum PCB;
Dielectric: FR-4;
Material: Aluminum;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Smart;
Copper Thickness: 0.5oz, 1oz, 2oz, 3oz;
Min.Hole Size: 0.2mm;
Board Size: Custom;
Min.Line Spacing: 0.10mm;
Board Thickness: 1.6mm or Custom;
Min. Line Width: 0.10mm;
Surface Finishing: Lf HASL/Enig/OSP etc.;
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Type: Aluminum LED PCB;
Dielectric: FR-4;
Material: Aluminum;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Smart;
Modelnumber: Aluminum PCB;
Copper Thickness: 0.5-3.0z;
Min.Hole Size: 0.25mm;
Min.Line Spacing: 0.2mm;
Min. Line Width: 0.2mm;
Aluminium PCB: Aluminium Foil for PCB,LED Aluminium PCB,Aluminium;
Board Size: Custom;
Board Thickness: 0.4-3.0mm;
Surface Finishing: HASL,Lead Free,Immersion Gold,Gold-Plate,OSP;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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