| Specification |
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide & Fr4;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Layer: 2;
Solder Mask: Green + Yellow Cover Film;
Board Thickess: 1.6mm Rigid and 0.1mm Flex;
Copper Thickness: 1oz;
Silk Screen: White;
Test: 100%;
Small Order: Accepter;
Board Material: Fr4+ Polymide;
PCB Type: Rigd-Flex PCB;
Product Type: Customized;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Size: 250mm;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Board Thickness: 0.2-8.0mm;
PCB Material: Fr-4, Cem-1, Hight Tg, Fr4 Halogen Free, Rogers;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Finish: Immersion Ni/Au;
Lead Time: 6-8 Working Days;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Board Thickness: 0.2-8.0mm;
PCB Material: Fr-4, Cem-1, Cem-3, Fr4 Halogen Free, Rogers;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Finish: Immersion Ni/Au;
Lead Time: 6-8 Working Days;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Color: Yellow and White and Black;
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