| Specification |
Structure: Double-Sided Rigid PCB;
Dielectric: FR-3;
Material: Phenolic Paper Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
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Structure: Metal Base Rigid PCB;
Dielectric: FR-4;
Material: Aluminium and Fr-4 Combined;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Okey;
Small Order: Acceptable;
Sales Service: OEM Service;
Engineer Support: Offer Copy PCB Gerber File and Small Modify;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-22 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Controlling Rang: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Use: Medical Device, Machine, Motor, Car...;
Max Thickness: 4mm;
Max Copper: 6oz;
Tg: Tg130-Tg180;
Inner Copper: 1 Oz;
Finish Copper: 2 Oz;
Solder Mask: Green;
Silk: White;
Surface Finish: HASL;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fr4;
Application: Consumer Electronics;
Flame Retardant Properties: 94V0;
Processing Technology: Delay Pressure Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Xjy;
Board Size: Customized;
Maximum Size: 500mm*800mm;
Board Color: Green/Black/Red/Yellow Customized;
Silkscreen Color: Green/Black/Red/Yellow Customized;
Design Improvement: Available;
Min. Line Space: 0.1mm;
Min.Hole Size: 0.15mm;
Board Thickness: 0.2mm-6.0mm;
Aspect Ratio: 13:1;
Insulation Layer Thickness: 0.075mm-5.0mm;
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Dielectric: FR-4;
Material: Phenolic Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Sthl;
Layer: 1-18;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 3 Mil;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
Service: SMT, DIP, Aging, Aoi;
Packaging: ESD Bag;
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