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Low-Power MCU
US$0.05-0.23 / Piece
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What is Low-Power MCU & Soc Chips for IoT Devices Arm/Risc-V Architecture Ideal for Smart Home & Wearable Applications

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-499 Pieces US$0.23

500-999 Pieces US$0.13

1,000-4,999 Pieces US$0.10

5,000+ Pieces US$0.05

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Complex
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Organic Resin
  • Model PCB
  • Brand OEM
  • Transport Package Vacuum+Carton Packing
  • Specification RoHS, ISO9001, UL, SGS
  • Trademark Fastline
  • Origin Shenzhen, China
  • PCB Layer 1-26 Layers
  • Solder Mask Green
  • Silk Screen White
  • Surface Treatment HASL
  • PCB Assembly Type SMT and DIP
  • PCB Service One Stop Service
  • Small Orders Accepted
  • Copper Thickness 1oz
  • Board Thickness 1.6mm
  • Lead Time 12-20 Days

Product Description

Multilayer PCBA Manufacturer with ISO UL Certification for Single Double PCB Assembly, OEM ODM Services for Consumer Electronics, Automotive, and Medical Applic -- Shenzhen Fastline Circuits Co.,Ltd. -- Fastline is a Leading PCB manufacturer in China with a facility area of more than 40,000 ...

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Low-Power MCU Comparison
Transaction Info
Price US$0.05-0.23 / Piece US$0.10 / Piece US$0.10 / Piece US$0.15-8.00 / Piece US$0.10 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: OEM;
PCB Layer: 1-26 Layers;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL;
PCB Assembly Type: SMT and DIP;
PCB Service: One Stop Service;
Small Orders: Accepted;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Lead Time: 12-20 Days;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Brand: No;
PCB Material: Fr4;
PCB Layer: 2;
PCB Impedance Control: No;
PCB Buried& Blind Vias: No;
PCB Copper Thickness: 35um;
Hard Gold: N/a;
Min Line/Width: 6mil;
Min Drill: 0.15mm;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: No;
PCB Material: Fr4;
PCB Layer: 2;
PCB Impedance Control: No;
PCB Buried& Blind Vias: No;
PCB Copper Thickness: 35um;
Hard Gold: N/a;
Min Line/Width: 6mil;
Min Drill: 0.15mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Abis;
Layer: Multilayer;
Solder Mask: Green/Blue/Red;
Surface Finish: HASL-Lead Free;
Legend Color: White;
Board Thickness: 1.6mm;
out Copper Thickness: 35um;
Inner Copper Thickness: 70um;
Raw Material: Fr4;
Type: Rigid Circuit Board;
Dielectric: Aluminum Base Board;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Brand: No;
PCB Material: Alu;
PCB Layer: 2;
PCB Impedance Control: No;
PCB Buried& Blind Vias: No;
PCB Copper Thickness: 35um;
Hard Gold: N/a;
Min Line/Width: 6mil;
Min Drill: 0.15mm;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

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