| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: PCB Assembly;
Base Material: Fr4;
Insulation Materials: Solder Mask;
Board Material: Fr4;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Surface Treatment: Immersion Gold;
Layer: 1-26 Layers;
Usage: for Electronic Products;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: 2oz Fr-4 Multilayer Circuit Board;
Layer: 1-18;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 3 Mil;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
Service: Aging Function Test;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Finishing: HASL;
Solder Mask: Green;
Copper Thicknes: 1oz;
Board Thickness: 1.6mm;
Min. Hole Size: 0.25mm;
Min. Line Wigth: 0.15mm;
Min. Line Spacing: 0.15mm;
Package: Vacuum;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layer: 1-20 Layers;
Raw Material: Fr-4, Cu Base, High Tg Fr-4, PTFE, Rogers, Teflon etc.;
Board Thickness: 0.20mm-8.00mm;
Board Outline Tolerance: +0.10mm;
Thickness Tolerance(T≥0.8mm): +/-8%;
Thickness Tolerance(T<0.8mm): +/-10%;
Minimum Line/ Space: 0.075mm;
Surface Finish/Treatment: HASL, Enig, Chem, Tin, Flash Gold, OSP, Gold Finger;
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Type: Rigid Circuit Board;
Dielectric: PTFE Ceramic;
Material: PTFE Ceramic;
Application: Ground Radar Warning Systems;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: OSP;
Base Material: PTFE Ceramic;
Insulation Materials: PTFE Ceramic;
Brand: Rogers;
Board Thick: 10mil (0.254mm), 25mil (0.635mm) 50mil (1.27mm), 7;
Surface Finish: Bare Copper, HASL, Enig, Immersion Tin, Immersion;
Copper Weight: 0.5oz , 1oz, 2oz;
Solder Mask: Green, Black, Blue, Yellow, Red etc;
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