| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Material: Fr4 and Polyimide;
Board Layer: 2 Layer Rigide and 2 Layer Flex;
Copper Thickness: 1 Oz;
Min. Line Space: 0.1mm;
Min.Hole Size: 0.15mm;
Solder Mask: Any Color;
Silkscreen: Any Color;
Surface Finishing: Gold Plate;
Lead Time: 5-6 Working Days;
Max PCB Size: 650*650mm;
Surface Finishing : HASL, Immersion Gold, OSP;
Plugged Diameter: 8mil-20mil; 0.20mm-0.50mm);
Laser Drilling Hole Size: 4mil(0.1mm);
Drilling Bit Size CNC): 6mil-256mil;
Boardness: +/-10%;
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Metal Coating: Cast Iron;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Model No.: Mr-S400;
PCB Tickness: 0.5 ~ 6.0mm;
PCB Weight: ≤5.0kg;
Conveyor Adjustment: Automatic;
Conveyor Height: 900±20mm;
PCB Direction: Left ~ Right(Right ~ Left);
Paste Height: 0 ~ 550um;
Accuracy: Xy (Resolution):10um;
Min Pad Pitch: ≥100um;
Inspection Head Quanlity: 1;
Camera Pixel: 12MP(Optional:5MP/21MP);
Optical Resolution: 5μm/10μm/15μm/20μm;
Fov Size: 20mm*15mm/40mm*30mm/60mm*45mm;
Detection Speed: 0.34s/Fov;
Power: AC200-230,50/60Hz,3kVA;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Number of Layers: Custom;
Copper Thickness: 1 Oz;
Product Name: PCB Assembly;
Surface Finishing: HASL;
Transport: EMS,DHL,UPS,FedEx,TNT;
Board Thickness: Custom, 1.6mm;
Testing Service: Ict,Fct,X-ray,Aoi;
Packaging Details: ESD Package with Cartons.;
Test: 100% Aoi / X-ray / Visual Test;
Min. Line Width: 0.075(3mil);
Supplier Type: OEM;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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