| Specification |
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Fr4;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Board Material: Polyimide;
Board Layer: 2;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Stiffener: 0.9mm Fr4;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
PCB Design: Custom Design Product;
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Structure: Multilayer FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Membrane;
Insulation Materials: Organic Resin;
Brand: Yizexin;
Product Certificate: ASTM F963-16, CCC, FCC, CE, RoHS, SGS, Ect;
Company Certification: Universal Studios, Bandai, BV, OHSAS1;
Color: Customized;
Feature: Enclosed and Waterproof Can Used at Any Environmen;
Rear Adhesive: 3m467, 3m468, 3m9448A, 3m 9080, 3m 200, 3m 300;
Materials: PC/PVC/Pet/PCB/FPC/PMMA/Silicon;
Life Expectancy: 1, 000, 000 Actuations Per Switch Position;
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Structure: Multilayer FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Membrane;
Insulation Materials: Organic Resin;
Brand: Yizexin;
Product Certificate: ASTM F963-16, CCC, FCC, CE, RoHS, SGS, Ect;
Company Certification: Universal Studios, Bandai, BV, OHSAS1;
Color: Customized;
Feature: Enclosed and Waterproof Can Used at Any Environmen;
Rear Adhesive: 3m467, 3m468, 3m9448A, 3m 9080, 3m 200, 3m 300;
Materials: PC/PVC/Pet/PCB/FPC/PMMA/Silicon;
Life Expectancy: 1, 000, 000 Actuations Per Switch Position;
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Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
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Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
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