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Alumina Ceramic PCB
US$0.30-0.33 / Piece
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What is Alumina Ceramic PCB Circuit Board with Fast Ceramic PCB Prototype

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.33

1,000+ Pieces US$0.30

Sepcifications

  • Type Rigid Circuit Board
  • Flame Retardant Properties V0
  • Dielectric FR-4
  • Base Material Ceramic
  • Insulation Materials Organic Resin
  • Processing Technology Electrolytic Foil
  • Application Consumer Electronics
  • Mechanical Rigid Rigid
  • Material Aluminum
  • Brand Fastline
  • Transport Package Vacuum Packing
  • Specification Certificates: UL, ROHS
  • Trademark FL
  • Origin China
  • Board Material Ceramic
  • Board Thickness 1.6 mm
  • Copper Thickness 1 Oz (35um)
  • Surface Treatment HASL Lead Free

Product Description

Product Description Commodity Introduction This is a type of Ceramic PCB for the application of IR Module. It's a 2 Layer board at 1.6mm thick. The base laminate is from ITEQ, Solder mask and silkscreen from Taiyo. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards ...

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Alumina Ceramic PCB Comparison
Transaction Info
Price US$0.30-0.33 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union
Quality Control
Management System Certification - ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
Annual Export Revenue - - - - -
Business Model - Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Ceramic;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Fastline;
Board Material: Ceramic;
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz (35um);
Surface Treatment: HASL Lead Free;
Type: Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.2mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 70/70μm;
Tg: 130°C;
Type: Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.2mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 70/70μm;
Tg: 130°C;
Type: Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.2mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 70/70μm;
Tg: 130°C;
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Brand: Hongyu;
Board Thickness: 1.7mm;
Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
Thermal Conductivity: 3.2W/M·K (Dielectric Layer);
Copper Foil: 170μm;
Tg: 150°C;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

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