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Microvia Fill Void Ratio <2% PCB with Sequential Lamination, Plasma-Cleaned Via Walls, and Full Resin Encapsulation for HDI Reliability

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.90

1,000-1,999 Pieces US$0.82

2,000-9,999,999 Pieces US$0.71

10,000,000+ Pieces US$0.60

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Communication
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Fr4
  • Insulation Materials Epoxy Resin
  • Brand Ca
  • Transport Package Vacuum+Carton Packing
  • Specification RoHS, ISO9001, UL, SGS
  • Trademark FL
  • Origin Shenzhen, China
  • Board Thickness 1.6mm
  • Board Layer 2 Layers
  • Copper Thickness 1 Oz
  • Solder Mask Blue
  • Silksreen White
  • Min Pad +/- 0.1mm (4mil)
  • Surface Finihsing HASL-Lf
  • Lead Time 6-8 Working Days
  • Shipping Type DHL, UPS, TNT, EMS, FedEx etc
  • Packing Type Carton + Vacuum
  • Test Fly Probe Testing
  • Min Board Thickness 0.1mm Only for Single and Double Sided
  • Min. Line Width/Space 0.05mm (2mil)
  • Outline Machining Accuracy +/- 0.1mm (4mil)
  • MOQ 1 PCS

Product Description

Fr4 PCB Electronic Board Fr4 Weighing Scale HASL FR4 Multilayer PCB ISO &ROHS&CCC certified Fast Prototype Mass Production No MOQ factory price ODM Custome Fastline could produce 1-26 layers PCB board for electronic products. providing PCB design, PCB fabrication, PCB clone, and PCB assembly ...

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Microvia Fill Void Ratio Comparison
Transaction Info
Price US$0.60-0.90 / Piece US$0.08-10.00 / Piece US$0.08-10.00 / Piece US$0.50-1.90 / Piece US$0.50-1.90 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T LC, T/T LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Management System Certification - ISO9001:2015, Others ISO9001:2015, Others Others Others
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Eastern Asia, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model - ODM, OEM ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Ca;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Blue;
Silksreen: White;
Min Pad: +/- 0.1mm (4mil);
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Test: Fly Probe Testing;
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Outline Machining Accuracy: +/- 0.1mm (4mil);
MOQ: 1 PCS;
Structure: Single-Sided Rigid PCB;
Dielectric: FR-4;
Material: Copper;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Flex Plus;
Copper Thickness: Max 5oz;
Length: Max. 4m (XL Exposure Machine);
Line Width: Min 0.05mm;
Color: Yellow;
Sample Delivery: 3~5days;
MP Delivery: 7~10days;
Structure: Single-Sided Rigid PCB;
Dielectric: FR-4;
Material: Copper;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Flex Plus;
Copper Thickness: Max 5oz;
Length: Max. 4m (XL Exposure Machine);
Line Width: Min 0.05mm;
Color: Yellow;
Sample Delivery: 3~5days;
MP Delivery: 7~10days;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Material: Fr4, H-Tg, It-180A, Cem, Aluminum;
Board Thickness: 0.4-5.0mm;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Copper Thickness: 0.5-10 Oz;
Layer: 1-60 Layers;
Min. SMD Size: 01005;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil;
Testing: E-Test, Fly Probe Test, Visual Checking,Aoi,X-ray;
MOQ: 1PCS;
Service: Turnkey PCB Assembly Service;
PCBA Test: Aoi, in-Circuit Test (Ict), Functioal Test (Fct);
PCB Max. Board Size: 620*1100mm;
Certificates: UL (E503048),ISO9001/ISO14001/IATF16949/ISO13485;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Board Material: Fr4, H-Tg, It-180A, Cem, Aluminum;
Board Thickness: 0.4-5.0mm;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Copper Thickness: 0.5-10 Oz;
Layer: 1-60 Layers;
Min. SMD Size: 01005;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil;
Testing: Visual Checking, Aoi, X-ray;
MOQ: 1PCS;
Service: Turnkey PCB Assembly Service;
PCBA Test: Aoi, in-Circuit Test (Ict), Functioal Test (Fct);
PCB Max. Board Size: 620*1100mm;
Certificates: UL (E503048), ISO9001/ISO14001/IATF16949/ISO13485;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Flex Plus(Xiamen) Co., Ltd

Gold Member Audited Supplier

Flex Plus(Xiamen) Co., Ltd

Gold Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

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