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Low-Volume & Niche PCB
US$0.38-6.98 / Piece
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What is High-Mix, Low-Volume & Niche PCB Specialist Tailored for R&D, Pilot Runs & Specialized Applications

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$6.98

1,000-9,999 Pieces US$3.86

10,000+ Pieces US$0.38

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Medical Instruments, Consumer Electronics
  • Flame Retardant Properties Hb, V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Transport Package Vacuum+Carton Packing
  • Specification RoHS, ISO9001, UL
  • Trademark FL
  • Origin China
  • Structure Multilayer Rigid PCB
  • Production Process Subtractive Process
  • Board Material Polyimide
  • Copper Thickness 1oz
  • Board Thickness 0.8mm
  • Min. Hole Size 0.2mm
  • Min. Line Width 01mm
  • Min. Line Spacing 0.09mm
  • Surface Finishing Enig
  • Is_Customized Yes
  • Test 100%
  • Service One-Stop
  • Min. Track 3/3mil
  • Lead Time 5-6days
  • Soldermask Red/ Blue/ Green/ Wihte/ Black

Product Description

Industrial Prototype PCBA SMT ODM OEM, UL CE High Precision Rigid Flex HDI Multilayer FR4 PCB ENIG ENEPIG Gerber BOM Printed Circuit Board Assembly Factory Product Parameters Product Parameters Model NO. CK-PCB Material Fiberglass Epoxy Application Consumer Electronics Flame Retardant ...

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Low-Volume & Niche PCB Comparison
Transaction Info
Price US$0.38-6.98 / Piece US$0.01-0.30 / Piece US$0.01-0.30 / Piece US$0.99-20.00 / Piece US$0.99-20.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic
Annual Export Revenue - - - - -
Business Model - - - ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments, Consumer Electronics;
Flame Retardant Properties: Hb, V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Structure: Multilayer Rigid PCB;
Production Process: Subtractive Process;
Board Material: Polyimide;
Copper Thickness: 1oz;
Board Thickness: 0.8mm;
Min. Hole Size: 0.2mm;
Min. Line Width: 01mm;
Min. Line Spacing: 0.09mm;
Surface Finishing: Enig;
Is_Customized: Yes;
Test: 100%;
Service: One-Stop;
Min. Track: 3/3mil;
Lead Time: 5-6days;
Soldermask: Red/ Blue/ Green/ Wihte/ Black;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Flex-Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 0.1mm;
Copper Thickness: 35um;
Surface Finish: Enig;
Solder Mask: Coverlay;
Legend: Without;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Flex-Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 0.1mm;
Copper Thickness: 35um;
Surface Finish: Enig;
Solder Mask: Coverlay;
Legend: Without;
Type: PCBA;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Unice;
Layer: 1-20;
Finished Outer Copper Thickness: H/H0z-5/50z;
Type: PCBA;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Unice;
Layer: 1-20;
Finished Outer Copper Thickness: H/H0z-5/50z;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier

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