| Specification |
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V2;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Layer: 2;
Solder Mask: Green + Yellow Cover Film;
Board Thickess: 1.6mm Rigid and 0.1mm Flex;
Copper Thickness: 1oz;
Silk Screen: White;
Test: 100%;
Small Order: Accepter;
Board Material: Fr4+ Polymide;
PCB Type: Rigd-Flex PCB;
Product Type: Customized;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide & Fr4;
Brand: Fastline;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
|
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
|
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
|
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
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