| Specification |
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Exceeding;
Delivery: 24hours~5 Days;
Service: 7*24 Hours Online;
Price: Factory Price;
Keyword: Custom PCB;
Product Name: Rigid PCB;
MOQ: 1 PCS;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Min. Line Width: 0.075mm(3mil);
Copper Thickness: 0.5-12oz(18-420um);
Min. Line Spacing: 0.075mm(3mil);
Board Thickness: 0.2-6.0mm;
Surface Finishing: Immersion Silver, Tin, Gold /HASL Lead Free;
One-Stop Service: PCB Assembly, Component Supply;
Testing Service: 100% E-Testing;
|
Structure: Fr4;
Dielectric: FR-4;
Material: Fr4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Board Material: Fr4;
Board Layer: 1;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB: Custom Design Product;
Layers: 1-26 Layers;
Dielectric Thickness: 3mil-8mil;
Laser Size: 4mil(0.1mm);
Max.Panel Dimension: 39000mi*47000mil;
Test: Aoi;
|
Structure: Fr4;
Dielectric: FR-4;
Material: Fr4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Board Material: Fr4;
Board Layer: 1;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB: Custom Design Product;
Layers: 1-26 Layers;
Dielectric Thickness: 3mil-8mil;
Laser Size: 4mil(0.1mm);
Max.Panel Dimension: 39000mi*47000mil;
Test: Aoi;
|
Structure: Fr4;
Dielectric: FR-4;
Material: Fr4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Board Material: Fr4;
Board Layer: 1;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB: Custom Design Product;
Layers: 1-26 Layers;
Dielectric Thickness: 3mil-8mil;
Laser Size: 4mil(0.1mm);
Max.Panel Dimension: 39000mi*47000mil;
Test: Aoi;
|
Structure: Fr4;
Dielectric: FR-4;
Material: Fr4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Board Material: Fr4;
Board Layer: 1;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB: Custom Design Product;
Layers: 1-26 Layers;
Dielectric Thickness: 3mil-8mil;
Laser Size: 4mil(0.1mm);
Max.Panel Dimension: 39000mi*47000mil;
Test: Aoi;
|
