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Rigid-Flex PCB
US$1.00-10.00 / Piece
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What is Professional Electronics OEM Supplier Circuit Board Rigid-Flex HDI PCB

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.00-10.00 / Piece

Sepcifications

  • Insulation Materials Organic Resin
  • Flame Retardant Properties V0
  • Application Aerospace
  • Transport Package Vacuum Package and Foam Protected
  • Specification PCB customized size
  • Trademark EEG
  • Origin Shenzhen
  • Base Material Pi+Fr4
  • Service 7*24 Hours Online
  • Technology Lead The Industry
  • Processing Technology Electrolytic Foil
  • Delivery 5days
  • Keyword FPC, Rigid-Flex, PCB Flexible PCB, Motherboard
  • Certification RoHS, UL CE, GS, ISO

Product Description

Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and power and energy PCB. Buyers from international markets choose to source from us because of our ...

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Rigid-Flex PCB Comparison
Transaction Info
Price US$1.00-10.00 / Piece US$0.66-0.88 / Piece US$0.01-10.00 / Piece US$0.01-100.00 / Piece US$0.10-80.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T, PayPal, Western Union, Small-amount payment, VTB LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Product Certification RoHS, UL CE, GS, ISO - - - UL, ISO9001&ISO14001, SGS, RoHS,Ts16949
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Western Europe North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
Layer Count: 4-Rigid, 2-Flex;
Copper Thickness: 1/1/1/1oz;
Board Material: Fr4;
Board Thickness: 1.6mm;
Solder Mask: Yellow;
Silk Screen: Orange;
Surface Treatment: HASL Lead Free;
Dielectric: FR-4;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Layer: 1-2 Layers;
Common Finish Board Thickness: 0.3-5mm;
Raw Material: Aluminum Base, Copper Base;
Min Line Width/Space: 3mil(0.075mm);
Impedance Control Tolerance: +/-10%;
Solder Mask/Silkscreen: Custom;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Industry Area;
Layer: 1-2 Layers;
Common Finish Board Thickness: 0.3-5mm;
Raw Material: Aluminum Base, Copper Base;
Min Line Width/Space: 3mil(0.075mm);
Impedance Control Tolerance: +/-10%;
Surface Finishing: Lead Free HASL, Immersion Gold(Enig), Immersion SL;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Special Process: Stiffeners etc;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Copper Thickness: 0.5-8oz;
Enig Thickness: 1-3u'';
Hard Gold Thickness: 5-50u'';
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Brand: Abis;
Supplier Name

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

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