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Rigid-Flex PCB
US$1.00-10.00 / Piece
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What is OEM Manufacturing Printed Circuit Board Fast Prototype Rigid-Flex PCB Solutions

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.00-10.00 / Piece

Sepcifications

  • Insulation Materials Organic Resin
  • Flame Retardant Properties V0
  • Application Aerospace
  • Transport Package Vacuum Package and Foam Protected
  • Specification PCB customized size
  • Trademark EEG
  • Origin Shenzhen
  • Base Material Pi+Fr4
  • Service 7*24 Hours Online
  • Technology Lead The Industry
  • Processing Technology Electrolytic Foil
  • Delivery 5days
  • Keyword FPC, Rigid-Flex, PCB Flexible PCB, Motherboard
  • Certification RoHS, UL CE, GS, ISO

Product Description

Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and power and energy PCB. Buyers from international markets choose to source from us because of our ...

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Rigid-Flex PCB Comparison
Transaction Info
Price US$1.00-10.00 / Piece US$0.01-20.00 / Piece US$0.01-20.00 / Piece US$0.01-20.00 / Piece US$0.01-20.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T, PayPal, Western Union, Small-amount payment, VTB LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Product Certification RoHS, UL CE, GS, ISO - - - -
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
Insulation Materials: Metal Composite Materials;
Flame Retardant Properties: HB;
Application: Digital Products;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Flame Retardant Properties: HB;
Application: Digital;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V1;
Application: LED,Equipment, Device;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V1;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, LED;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Supplier Name

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

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