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FPC
US$1.00-10.00 / Piece
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What is Customized High Quality Double-Side China FPC Manufacturing for Electronics

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.00-10.00 / Piece

Sepcifications

  • Insulation Materials Organic Resin
  • Flame Retardant Properties V0
  • Application Aerospace
  • Transport Package Vacuum Package and Foam Protected
  • Specification Customized
  • Trademark EEG
  • Origin Shenzhen
  • Certification RoHS, UL CE, GS, ISO
  • Base Material Polyimide, Fr4, Pi
  • Keyword Custom PCB
  • Lead Time 6-8 Working Days
  • Service 7*24 Hours Online
  • One-Stop Service PCB Assembly, Component Supply
  • Price Factory Price
  • MOQ 1 PCS
  • Surface Finishing Immersion Ni/Au
  • Copper Thickness 0.5-12oz(18-420um)
  • Board Thickness 0.2-6.0mm
  • Min. Line Spacing 0.075mm(3mil)
  • Min. Hole Size 0.1mm(4mil) for HDI / 0.15mm(6mil)
  • Min. Line Width 0.075mm(3mil)
  • Testing Service 100% E-Testing

Product Description

Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and power and energy PCB. Buyers from international markets choose to source from us because of our ...

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FPC Comparison
Transaction Info
Price US$1.00-10.00 / Piece US$0.01-20.00 / Piece US$0.01-20.00 / Piece US$0.01-20.00 / Piece US$0.01-20.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T, PayPal, Western Union, Small-amount payment, VTB LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Product Certification RoHS, UL CE, GS, ISO - - - -
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Polyimide, Fr4, Pi;
Keyword: Custom PCB;
Lead Time: 6-8 Working Days;
Service: 7*24 Hours Online;
One-Stop Service: PCB Assembly, Component Supply;
Price: Factory Price;
MOQ: 1 PCS;
Surface Finishing: Immersion Ni/Au;
Copper Thickness: 0.5-12oz(18-420um);
Board Thickness: 0.2-6.0mm;
Min. Line Spacing: 0.075mm(3mil);
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Min. Line Width: 0.075mm(3mil);
Testing Service: 100% E-Testing;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V1;
Application: LED,Equipment, Device;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V1;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, LED;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V1;
Application: Consumer Electronics;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Brand: Abis;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Used in: Automotive, Aerospace, Digital, Computer, LED, etc;
Solder Mask: N/a;
Max Copper: 6 Oz;
Min Thickness: 0.15 mm;
Max Layer: 8 Layer;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Supplier Name

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

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