| Specification |
Type: Aluminum PCB;
Material: Aluminum;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum/Fr4;
Insulation Materials: Epoxy Resin;
Brand: Exceeding;
Surface Finishing: HASL Lf, Enig, OSP, Immersion Au, Silver, Tin;
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 5-10 Days;PCBA, 2-3weeks;
LED Type: 3528/2835/5050/3014/5730/3030;
Thermal Conductivity: 0.8-3W/M.K;
Keyword: LED PCB, Aluminium PCB, Motherboad, Circuit Board;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Fr4;
Copper Thickness: 1oz;
Surface Finishing: Lf-Hal;
Solder Mask Type: Black;
Board Thickness: 1.0mm;
Min. Hole Size: 0.2mm;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Copper Thickness: 1oz;
Surface Finishing: Immersion Gold;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Line Spacing: 0.2mm;
Min. Line Width: 0.2mm;
Layer: 2 Layer;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Copper Thickness: 1oz;
Surface Finishing: HASL;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Line Spacing: 0.2mm;
Min. Line Width: 0.2mm;
Layer: 2 Layer;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Copper Thickness: 1oz;
Surface Finishing: HASL;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Min. Line Spacing: 0.2mm;
Min. Line Width: 0.2mm;
Layer: 2 Layer;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
|