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electronic component
US$0.03-0.15 / Piece
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What is Bluetooth Low-power Energy HM-BT4501BW Pass-through Module

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

5,000 Pieces US$0.03-0.15 / Piece

Sepcifications

  • Conductive Type Unipolar Integrated Circuit
  • Integration LSI
  • Technics Thin Film IC
  • Transport Package Carton
  • Trademark HOPERF
  • Origin China
  • shape DIP

Product Description

-Data Sheet -Product Overview * HM-8T4501B is a wireless data pass-through module based on CMT4501 low-power Bluetooth 4.0 chp . * By connecting with MCU , it can quicky realize the connection and data communication between the module and Bluetooth devices such as smart phones and ...

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electronic component Comparison
Transaction Info
Price US$0.03-0.15 / Piece US$0.10-0.30 / Piece US$0.10-0.30 / Piece US$0.50-1.00 / Piece US$0.50-1.00 / Piece
Min Order 5,000 Pieces 100 Pieces 1,000 Pieces 1 Piece 1 Piece
Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets Southeast Asia/ Mideast North America, Eastern Europe, Eastern Asia, Western Europe North America, Eastern Europe, Eastern Asia, Western Europe North America, Eastern Europe, Eastern Asia, Western Europe North America, Eastern Europe, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: 1-3 months
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: 1-3 months
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: 1-3 months
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: 1-3 months
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Conductive Type: Unipolar Integrated Circuit;
Integration: LSI;
Technics: Thin Film IC;
shape: DIP;
Conductive Type: Standard;
Integration: SSI;
Technics: Semiconductor IC;
shape: Flat;
Conductive Type: Standard;
Integration: SSI;
Technics: Semiconductor IC;
shape: Flat;
Conductive Type: Standard;
Integration: Standard;
Operating Temperature: -40°c ~ 100°c (Tj);
Technics: Standard;
Number of Labs/Clbs: 250;
Number of Logic Elements/Cells: 4000;
Total RAM Bits: 193536;
Number of I/O: 178;
Voltage - Supply: 1.15V ~ 1.25V;
Package / Case: 256-Fbga;
shape: Surface Mount;
Conductive Type: Standard;
Integration: Standard;
Operating Temperature: -40°c ~ 100°c (Tj);
Technics: Standard;
Number of Labs/Clbs: 250;
Number of Logic Elements/Cells: 4000;
Total RAM Bits: 193536;
Number of I/O: 178;
Voltage - Supply: 1.15V ~ 1.25V;
Package / Case: 256-Fbga;
shape: Surface Mount;
Supplier Name

CTC Technology Co., Ltd.

Diamond Member Audited Supplier

Emi International (Hk) Co. Ltd

Diamond Member Audited Supplier

Emi International (Hk) Co. Ltd

Diamond Member Audited Supplier

Emi International (Hk) Co. Ltd

Diamond Member Audited Supplier

Emi International (Hk) Co. Ltd

Diamond Member Audited Supplier

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