| Specification |
Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
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Structure: Multilayer FPC;
Material: Copper;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Des;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Flex Plus;
Copper Thickness: 1/3 Oz ~2 Oz;
Length: Max. 4mm (XL Exposure Machine);
Line Width: Min 0.05mm;
Color: Yellow, Green;
Sample Delivery: 3~5days;
MP Delivery: 7~10days;
Soler Mask Allignment Tolerance: 4mil;
Silkscreen Alignment Tolerance: 6mil;
Layer: 2+2;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: UC;
Board Layer: 1;
Board Thickness: 0.15-0.2mm;
Surface Treatment: Enig;
Size: 500*8mm;
Finished Copper Thickness: 35um;
Lead Time: 7 Working Days;
PCB Testing: Flying Probe Testing/E-Testing;
Fast Turn: 3 Working Days;
Ipc Standards: Ipc-Class 2;
Base Material Type: Pi;
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Structure: Double-Sided FPC;
Material: Copper;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Des;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Flex Plus;
Copper Thickness: Max 5oz;
Length: Max. 4m (XL Exposure Machine);
Line Width: Min 0.05mm;
Color: Yellow;
Sample Delivery: 3~5days;
MP Delivery: 7~10days;
|
Structure: Multilayer FPC;
Material: Copper;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Des;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Flex Plus;
Copper Thickness: 1/3 Oz ~2 Oz;
Length: Max. 4mm (XL Exposure Machine);
Line Width: Min 0.05mm;
Color: Yellow, Green;
Sample Delivery: 3~5days;
MP Delivery: 7~10days;
Soler Mask Allignment Tolerance: 4mil;
Silkscreen Alignment Tolerance: 6mil;
Layer: 2+2;
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