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FPC
US$1.00 / Piece
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What is Custom Shaped Flexible Circuits with Adhesive Backing

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.00 / Piece

Sepcifications

  • Structure Multilayer FPC
  • Material Pi
  • Combination Mode Adhesive Flexible Plate
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
  • Conductive Adhesive Conductive Silver Paste
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Cry
  • Transport Package Vacuum Packing
  • Specification ODM/OEM
  • Trademark CRY
  • Origin China

Product Description

Key attributes Base Material PI Board Thickness 0.11mm-0.5mm Board Size Custom made fpc Board Size Custom made fpc Model Number MT3-22 Type FPC Place of Origin Guangdong, China Brand Name ODM/OEM Copper Thickness 35um Min. Hole Size 0.075 mm Min. Line Width 0.05 mm Min. Line ...

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FPC Comparison
Transaction Info
Price US$1.00 / Piece US$0.10 / Piece US$0.20-1.20 / pieces US$0.40-1.20 / pieces US$0.40-1.20 / pieces
Min Order 1 Piece 100 Pieces 5 pieces 5 pieces 5 pieces
Payment Terms LC, T/T, D/P, Western Union, PayPal, Small-amount payment T/T T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification - - - RoHS/CE RoHS/CE
Management System Certification - - - - -
Trade Capacity
Export Markets Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - - - -
Business Model Own Brand - Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Xtz;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pi;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.3oz-3oz;
Min.Hole Size: 0.15mm;
Min. Line Width: 0.075mm;
Surface Finishing: Enig, Immersion Silver, OSP;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pi/Pet;
Insulation Materials: Organic Resin;
Brand: Smart;
Type: FPC;
Copper Thickness: 0.3oz-3oz;
Min.Hole Size: 0.15mm;
Min. Hole Size: 0.15mm;
Board Size: Custom;
Min.Line Width: 0.075mm;
Min.Line Spacing: 0.075-0.9mm;
Board Thickness: 0.057-0.6mm;
Surface Finishing: Enig, Immersion Silver, OSP;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pi/Pet;
Insulation Materials: Organic Resin;
Brand: Smart;
Type: FPC;
Copper Thickness: 0.3oz-3oz;
Min.Hole Size: 0.15mm;
Board Size: Custom;
Min.Line Width: 0.075mm;
Min.Line Spacing: 0.075-0.9mm;
Board Thickness: 0.057-0.6mm;
Surface Finishing: Enig, Immersion Silver, OSP;
Supplier Name

Shenzhen Chengruyuan Technology Co., Ltd.

Diamond Member Audited Supplier

SHENZHEN XIANGTIANZHONG TECHNOLOGY CO., LTD.

Gold Member Audited Supplier

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

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