| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: Ceramics;
Material: Ceramics;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Ceramics;
Insulation Materials: Ceramics;
Brand: Customized;
Model No.: Multilayers Ceramic PCB;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Testing Service: Electrical Testing, Flying Probe Tester;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
Surface Finishing: Asl\OSP\Immersion Gold;
Layers: 1-4 Layers;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fr4;
Application: Medical Instruments;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
PCB Layer: 1-26 Layers;
SMT Line Quantity: : 30;
Solder Mask: Any;
Silk Screen: Any;
Surface Treatment: HASL;
PCB Assembly Type: SMT and DIP;
PCB Service: One Stop Service;
Small Orders: 1 PCS Is Ok;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Board Dimensions: Smallest Size: 50*50mm;
BGA-Min Pitch: 0.25mm;
Testing Procedures: Visual Inspection ; X-ray Inspection ;Aoi (Automat;
Board Shape: Rectangular ; Round ;Slots and Cut Outs; Complex a;
Lead Time: 12-20 Days;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Copper Thickness: 1oz;
Board Material: Fr4;
Board Thickness: 1.6mm;
Solder Mask: White, Red, Green, Black;
Surface Treatment: Enig;
Outline Tolerance: +/-10%;
Testing: 100%;
Supply: Fast;
Service: One-Stop;
Mini Hole: 0.1mm;
MOQ: 1PCS;
Thickness Tolerance: +/-10%;
File: PCB File;
X-out: +/-5%;
Payment: T/T, D/P, L/C, Paypal, Western Union;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Based on Custom Made;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil, Delay Pressure Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Type: Rigid Circuit Board;
Mechanical Rigid: Rigid;
Board Material: Fr4;
Board Layer: 4;
Board Thickness: 1.6mm;
Copper Thickness: 2 Oz;
Max PCB Size: 650*650mm;
Min Hole: 0.1mm;
Surface Finishing: Enig;
Solder Mask: Any;
Test: 100%;
Service: One-Stop;
Packaging: Vacuum + Carton;
Payment: T/T, Paypal, Western Union;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V2, HB;
Processing Technology: Electrolytic Foil, Delay Pressure Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: FL;
Board Material: Fr4;
Board Layer: 4;
Board Thickness: 1.6mm;
Copper Thickness: 2 Oz;
Max PCB Size: 650*650mm;
Min Hole: 0.1mm;
Min Trace: 0.15mm;
Surface Finishing: Enig;
Solder Mask: Any;
Lead Time: 4-5 Working Days;
Test: 100%;
Service: One-Stop;
Packaging: Vacuum + Carton;
Payment: T/T, Paypal, Western Union;
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