| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Gold Plating Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Board Thickness: 1.6mm;
Model Number: PCB;
Place of Origin: Guangdong, China;
Copper Thickness: 0.5oz-5oz;
Min. Line Width: 0.075mm;
Min. Line Spacing: 0.075mm;
Service: One-Stop OEM Service;
|
Type: Rigid Circuit Board;
Dielectric: Woven E-Glass Reinforced Epoxy Resin;
Material: Shengyi S1000-2m;
Application: RF Devices;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL;
Base Material: Shengyi S1000-2m;
Insulation Materials: Fiberglass-Reinforced Polymer Matrix;
Brand: Shengyi;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
|
Type: Rigid Circuit Board;
Dielectric: Iteq It-180A Fr-4 Laminate;
Material: High-Tg (≥170°c) Epoxy Resin System;
Application: Industrial Automation (PLC Controllers);
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: Shengyi S1000-2m;
Insulation Materials: Fiberglass-Reinforced Composite;
Brand: Iteq;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
|
Type: Rigid Circuit Board;
Dielectric: Fr-4 Tg170℃ Substrate;
Material: Fr-4 Laminate (Iteq Brand);
Application: Automotive;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Glass Epoxy Laminate;
Insulation Materials: Fr-4 Laminate (Iteq Brand);
Brand: Iteq/Taiyo;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
|
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 2/4/6/8/12/Custom;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.15mm;
Board Size: Custom;
Board Thickness: 0.2-4.0mm;
|