| Specification |
Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
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Structure: Multilayer FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Display Screen;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Surface Finishing: Enig;
Copper Thickness: 0.2~1.0mm;
Board Thickness: 0.1mm;
Min. Hole Size: 0.15mm;
Min. Line Wigth: 0.25mm;
Min. Line Spacing: 0.25mm;
Color: Yellow;
Size: 5*5mm~50*50mm;
Tolerance: 0.13mm;
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Structure: Double-Sided FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Base Material: Membrane;
Surface Finishing: Enig;
Copper Thickness: 35um;
Board Thickness: 0.1mm;
Min. Hole Size: 0.15mm;
Min. Line Wigth: 0.25mm;
Min. Line Spacing: 0.25mm;
Package: Vacuum;
Shipping: DHL.FedEx, Ect;
Layer: 2;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Medical;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Tg: Tg130-Tg180;
Inner Copper: 1 Oz;
Finish Copper: 2 Oz;
Solder Mask: Green;
Silk: White;
Surface Finish: HASL;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Organic Resin;
Layer Counts: 1-20;
Mateiral: Fr/4, High Tg Fr/4, PTFE, Rogers, etc;
Maxium Size: 600*1200mm;
Board Thickness: 0.20mm-8.00mm;
Surface Finish: HASL, Enig, Chen. Tin, Fash Gold, Asp, Gold Finger;
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