| Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: Copper Substrate PCB;
Customized: Customized;
Condition: New;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Brand: Customers Brand;
Base Material 1: MCPCB;
Base Material Thickness: 0.8mm-4.0mm;
Min. Hole Diameter: 0.25mm;
Min. Line Spacing: 0.2mm;
Testing Service: 100% Aoi Testing;
Color: Red Blue Green Black White;
Surface Finishing: Enig, HASL, OSP;
MOQ: 1PCS;
Product Type: Metal Core PCB;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: 1-36layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Turkey Service: PCB/Component Sorcing/SMT/Package;
Factory Capability: 20 Million Chips/Day,600 Million/Month;
Component Size: 01005,LGA,Fine Pitch BGA,Qfn;
Traceability: Full Barcode/Mes System(Component,Batch,Porcess);
Machine Detail: 21 SMT Lines,4 DIP Lines;
Assembly Detail: SMT,Pop,DIP,COB,Flip Chip,SIP;
Inspection: Aoi,Spi,X-ray,Ict&Fct;
Value-Added Service: Bom Analysis,Confirmal Coating,Programming;
Certifications: ISO9001,ISO14001,IATF16949,CSR,Hsf,QC080000;
Material: Complex;
Package: Carton;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: 1-36layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Turkey Service: PCB/Component Sorcing/SMT/Package;
Factory Capability: 20 Million Chips/Day,600 Million/Month;
Component Size: 01005,LGA,Fine Pitch BGA,Qfn;
Traceability: Full Barcode/Mes System(Component,Batch,Porcess);
Machine Detail: 21 SMT Lines,4 DIP Lines;
Assembly Detail: SMT,Pop,DIP,COB,Flip Chip,SIP;
Inspection: Aoi,Spi,X-ray,Ict&Fct;
Value-Added Service: Bom Analysis,Confirmal Coating,Programming;
Certifications: ISO9001,ISO14001,IATF16949,CSR,Hsf,QC080000;
Material: Complex;
Package: Carton;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: 1-36layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Turkey Service: PCB/Component Sorcing/SMT/Package;
Factory Capability: 20 Million Chips/Day,600 Million/Month;
Component Size: 01005,LGA,Fine Pitch BGA,Qfn;
Traceability: Full Barcode/Mes System(Component,Batch,Porcess);
Machine Detail: 21 SMT Lines,4 DIP Lines;
Assembly Detail: SMT,Pop,DIP,COB,Flip Chip,SIP;
Inspection: Aoi,Spi,X-ray,Ict&Fct;
Value-Added Service: Bom Analysis,Confirmal Coating,Programming;
Certifications: ISO9001,ISO14001,IATF16949,CSR,Hsf,QC080000;
Material: Complex;
Package: Carton;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: 1-36layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Turkey Service: PCB/Component Sorcing/SMT/Package;
Factory Capability: 20 Million Chips/Day,600 Million/Month;
Component Size: 01005,LGA,Fine Pitch BGA,Qfn;
Traceability: Full Barcode/Mes System(Component,Batch,Porcess);
Machine Detail: 21 SMT Lines,4 DIP Lines;
Assembly Detail: SMT,Pop,DIP,COB,Flip Chip,SIP;
Inspection: Aoi,Spi,X-ray,Ict&Fct;
Value-Added Service: Bom Analysis,Confirmal Coating,Programming;
Certifications: ISO9001,ISO14001,IATF16949,CSR,Hsf,QC080000;
Material: Complex;
Package: Carton;
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