| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: Ceramics;
Material: Ceramics;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Ceramics;
Insulation Materials: Ceramics;
Brand: Customized;
Model No.: Multilayers Ceramic PCB;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Testing Service: Electrical Testing, Flying Probe Tester;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
Surface Finishing: Asl\OSP\Immersion Gold;
Layers: 1-4 Layers;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fr4;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Voltage: DC12V;
Impedance Control Tolerance: 10%;
MOQ: 1PCS;
Layer: 1 - 50 Layer;
Thicnkness Board: 1.6mm;
Solder Mask Colour: Green, Blue, White, Black, Yellow, Red;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Min Space: 0.1mm;
Min Hole Location Tolerance: ±0.075mm;
Supply: Fast;
Service: One-Stop;
Testing: 100%;
File: PCB File;
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Structure: Double-Sided Rigid PCB, Multilayer Rigid PCB;
Dielectric: Fr-3, Fr-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Computer, Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process, Subtractive Process;
Base Material: Fr4, Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-3;
Material: Phenolic Paper Laminate;
Application: Computer;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 2 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: OSP;
Lead Time: 6-8 Working Days;
Test: Fly Probe Testing;
Min. Line Space: 0.1mm;
Min.Hole Size: 0.15mm;
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