| Specification |
Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Thickness Board: 2.0mm;
Copper: 1oz;
Surface: Enig;
Solermask: Blue/ White/ Black/ Red/ Green;
Mini Holes: 0.1mm;
Mini Trace: 3 Mil/ 3 Mil;
Supplier: Fast;
MOQ: 1 PCS;
Leading Time: 6-8 Working Days;
Service: One-Stop;
Testing: 100%;
File: PCB File;
Shipping Type: DHL, UPS, FedEx, TNT, EMS etc.;
Payment: Paypal, Tt, Western Union, D/P;
Gerber File: PCB File, Bom;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Board Material: Polyimide;
Board Layer: 4;
Board Thickness: 0.2 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB Design: Custom Design Product;
Supply: Fast;
MOQ: 1 PCS;
Testing: Aoi X-ray;
Service: One-Stop;
File: PCB File;
|
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Board Material: Polyimide;
Board Layer: 4;
Board Thickness: 0.2 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB Design: Custom Design Product;
Supply: Fast;
MOQ: 1 PCS;
Testing: Aoi X-ray;
Service: One-Stop;
File: PCB File;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Board Material: Fr4;
Board Layer: 4;
Board Thickness: 1.6mm;
Copper Thickness: 1 Oz;
Min. Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Solder Mask: Green/Blue/ White/ Black/ Red;
Silkscreen: White/Yellow;
Surface Finishing: HASL-Lf;
Lead Time: 8-10 Working Days;
Supply: Fast;
Service: One-Stop;
Testing: 100%;
MOQ: 1 PCS;
Shipping Type: DHL, UPS, FedEx, TNT, EMS etc.;
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