| Specification |
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Electronics Device;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Gw;
Board Size: Customization;
Copper Thickness: 0.5-6 Oz;
Service: PCB Design;
Connector: Type C/USB/Micro USB/WiFi;
Layer: 1-60 Layers;
Testing Service: 100%;
Solder Mask Color: Green, Yellow, White, Blue, Black, Red...;
Board Thickness: 0.3 mm- 4 mm;
Samples: Customized, Fast Delivery;
MOQ: 1 PCS;
Price: Please Contact Us;
Packaging Details: Inner Package: Vacuum Package+Dryer;
Outer Package: Carton Package+Bulb Package ,Special Packages Requ;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Electronics Device;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Gw;
Board Size: Customization;
Copper Thickness: 0.5-6 Oz;
Service: PCB Design;
Connector: Type C/USB/Micro USB/WiFi;
Layer: 1-60 Layers;
Testing Service: 100%;
Solder Mask Color: Green, Yellow, White, Blue, Black, Red...;
Board Thickness: 0.3 mm- 4 mm;
Samples: Customized, Fast Delivery;
MOQ: 1 PCS;
Price: Please Contact Us;
Packaging Details: Inner Package: Vacuum Package+Dryer;
Outer Package: Carton Package+Bulb Package ,Special Packages Requ;
|
Type: Custom;
Dielectric: Custom;
Material: Custom;
Application: Custom;
Flame Retardant Properties: Custom;
Mechanical Rigid: Custom;
Processing Technology: Custom;
Base Material: Custom;
Insulation Materials: Custom;
Brand: Nova;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Bluetooth;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: UC;
Board Layer: 4;
Material Finished Thickness: 0.8mm;
Special: It180A;
Finished Copper Thickness: 1oz;
Surface Treatment: Immersion Gold/HASL Lead Free/ Immersion Silve;
Solder Mask Color: Green/White/Black/Blue/Red;
Lead Time: 12 Working Days;
Fast Turn: 5 Working Days;
PCB Testing: E-Testing, Flying Probe Testing;
|
