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PCB
US$0.68-4.68 / Piece
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What is 20 Layers Mixed Pressure PCB Multilayer Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.68-4.68 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Paper Phenolic Copper Foil Substrate
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand China Dragon
  • Transport Package Safe Packing
  • Specification 20 layers FR4 PCB
  • Trademark China Dragon
  • Origin China
  • Mixed Pressure Board Mixed Pressure Board

Product Description

China Dragon Electronic Industrial Co., LTD. We provide a one-stop service including PCB fabrication, components sourcing and SMT assembly, wave soldering ,burning software,final assembly and function testing. 18 Years PCB &PCBA Factory SMT DIP Bare PCB And Electronic Components Assembly ...

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PCB Comparison
Transaction Info
Price US$0.68-4.68 / Piece US$0.01-100.00 / Piece US$0.01-10.00 / Piece US$0.01-10.00 / Piece US$60.00-75.00 / Square Meter
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 5 Square Meters
Payment Terms PayPal, T/T LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T
Quality Control
Product Certification - UL, ISO9001&ISO14001, SGS, RoHS Report UL,ISO9001&ISO14001,SGS,RoHS Report UL,ISO9001&ISO14001,SGS,RoHS,Ts16949 -
Management System Certification - - - - -
Trade Capacity
Export Markets North America, Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Domestic
Annual Export Revenue - - - - -
Business Model ODM, OEM - - - Own Brand, ODM, OEM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: China Dragon;
Mixed Pressure Board: Mixed Pressure Board;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Enig Thickness: 1-3u'';
Hard Gold Thickness: 5-50u'';
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Layers: 2-20layers;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Enig Thickness: 1-3u'';
Hard Gold Thickness: 5-50u'';
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Enig Thickness: 1-3u'';
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Hard Gold Thickness: 5-50u'';
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Layer: 1-20layers;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Zapon;
Surface: OSP,Immersion Gold,Hal Lead Free,Hal;
Solder Mask: Green,Red,Yellow,White,Black,Blue,etc;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 3-5days;
Supplier Name

China Dragon Electronic Industrial Co., Limited

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Zhejiang Dejia Electronics Technology Co.,Ltd.

Gold Member Audited Supplier

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