| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-2;
Customized: Customized;
Condition: New;
Product Name: Mobile Fast Charging PCBA;
Number of Layers: Double-Sided;
Color: Customized Colors;
Insulation Layer Thickness: Conventional Board;
Application: Android Ios;
MOQ: 1000PCS;
Insulation Material: Organic Resin;
Reinforcement Material: Synthetic Fiber Based;
Input Voltage Range: 6V-32V;
Output Voltage: Default 5V;
|
Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Brand: Exceeding;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple..etc;
Board Thickness: 0.2mm-8mm;
Copper Thickness: 18um-3500um(0.5- 100oz);
Service: PCB/Componentssourcing/Assembly/Test/Package;
PCBA QA: Full Test Include Aoi, in-Circuit Test (Ict);
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
Profiling Punching: Routing, V-Cut, Beveling;
Surface Finishing: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible P;
PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
|
Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Brand: Exceeding;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple..etc;
Board Thickness: 0.2mm-8mm;
Copper Thickness: 18um-3500um(0.5- 100oz);
Service: PCB/Componentssourcing/Assembly/Test/Package;
PCBA QA: Full Test Include Aoi, in-Circuit Test (Ict);
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
Profiling Punching: Routing, V-Cut, Beveling;
Surface Finishing: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible;
PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
|
Metal Coating: Tin;
Mode of Production: SMT&DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
BGA Minimum Dia: 01005;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCB Layer: Max 64 Layers;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Function Testing: Spi , Aoi , Ict, Fct , X-ray ,RoHS and Aging;
IP Protection: Strong Believe in IP Protection with Proven Record;
Turkey Service: Turkey Sourcing ,Procurement and Material Manageme;
|
