| Specification |
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Circuit Board Electronics Air Cleaner Board PCB;
MOQ: 1 PCS;
Layer: 1-18 Layer;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
Copper Thickness: 0.5oz, 1oz, 2oz;
Board Thickness: 0.2mm-4mm;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
Service: Printed Circuit Board PCBA Board, SMT, Tht, Test;
Other Service: PCBA Layout and Design, Engineering Support;
Specialised: Medical, Industrial, Control Board, CE;
Product Name: Circuit Board Electronics Air Cleaner Board PCB;
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Type: Combining Rigid Circuit Board;
Dielectric: Ceramic;
Material: Alumina Ceramic;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Alumina Ceramic;
Insulation Materials: Metal Composite Materials;
Model: PCB;
Brand: Ry;
Max Working Temperature: 1600c;
Rycolor: White, Ivory, Pink;
Special: Thin Film Alumina Ceramic;
Product: Alumina Parts;
Name: Machine Alumina Ceramic Substrate;
Raw Material: 60-99.7% Alumina Ceramic;
Item: Alumina Ceramics Dbc Substrate;
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Type: Combining Rigid Circuit Board;
Dielectric: Ceramic;
Material: Alumina Ceramic;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Alumina Ceramic;
Insulation Materials: Metal Composite Materials;
Model: PCB;
Brand: Ry;
Max Working Temperature: 1600c;
Rycolor: White, Ivory, Pink;
Special: Thin Film Alumina Ceramic;
Product: Alumina Parts;
Name: Machine Alumina Ceramic Substrate;
Raw Material: 60-99.7% Alumina Ceramic;
Item: Alumina Ceramics Dbc Substrate;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Insulation Materials: Epoxy Resin;
Model: UC;
Brand: UC;
Layer: 1-24;
Material Type: Fr4 Tg11-180;
Solder Mask Color: Green/White/Black/Blue/Red;
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Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Pi Film (Polyimide);
Model: FPC;
Brand: Kotobo;
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