| Specification |
Application: Electronic Devices, Lighting, Power Supply, Semiconductors;
Material: Al2O3;
Thickness: Customized;
Finished Product: Ceramic Circuit Board;
Substrate Material: 96%, 99.6% Alumina;
Surface Metallization Process: Mo-Mn Metallization and Ni Plating;
Feature: Excellent Electrical and Thermal Properties;
Usage: to Realize Electrical Connections;
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Application: Refractory, Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Mullite-Cordierite;
Cell Shape: Circular, Cell Shape Is Customizable;
Cell Number: Cell Number and Size Are Customizable;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
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Application: Refractory, Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Zirconia Corundum;
Cell Shape: Circular, Cell Shape Is Customizable;
Cell Number: Cell Number and Size Are Customizable;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
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Application: Refractory, Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Zirconia Corundum;
Cell Shape: Circular, Cell Shape Is Customizable;
Cell Number: Cell Number and Size Are Customizable;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
|
Application: Refractory, Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Zirconia Corundum;
Cell Shape: Circular, Cell Shape Is Customizable;
Cell Number: Cell Number and Size Are Customizable;
Groove: Plate, Single, Double, Cross, Four Footer, Chute;
Type: Honeycomb Ceramic Thermal Storage Media;
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