High Performance Aln Aluminium Nitride Metallized Ceramic Substrate for Power Electronics
Price
Min. Order Reference FOB Price
10 Pieces US$1.00-100.00 / Piece
Sepcifications
- Application Electronic Devices, Lighting, Power Supply, Semiconductors
- Conductive Layer Thick Copper Layer
- Material AlN
- Process Direct Bonded Copper
- Thickness Customized
- Transport Package Vacuum Packaging
- Specification According to the Drawing
- Trademark JingHui
- Origin China
- Feature High Current Capacity and Heat Dissipation
- Copper Thickness 100-600um
- Use Temperature 300-400℃
- Other Available Material Al2O3
- Other Available Process Mo-Mn Metallization
Product Description
High Performance AlN Aluminium Nitride Metallized Ceramic Substrate for Power Electronics Product Introduction Metallized ceramic substrates are key components in power electronic modules. They connect and fix multiple semiconductor devices such as SiC MOSFETs, Si IGBTs and Si diodes. The ceramic ...
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