| Specification |
Application: Electronic Devices, Lighting, Power Supply, Semiconductors;
Material: Al2O3;
Forming Method: Tape Casting;
Purity of Material: 96%, 99.6% Alumina;
Features: High Mechanical Strength, Small Dielectric Loss;
Usage: Blank Ceramic Circuit Board;
Optional Color: White, Ivory, Pink, Black;
Density: Over 3.70g/cm3;
Standard Thickness: 0.1-2.0mm Available;
Thickness Tolerance: ±0.03/0.05mm (Depending on Thickness);
Length and Width Tolerance: ±2mm;
Customized Service: OEM, ODM, Prototyping, Mass Production;
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Application: Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Alumina, Mullite, Cordierite, Corundum;
Water Absorption: <5;
Density: 2.16-2.48;
Cell Number: 13 Cell, 25 Cell, 40 Cell, 43 Cell, 50 Cell, 60 Cell;
Type: Honeycomb Ceramic Thermal Storage Media;
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Application: Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Alumina, Mullite, Cordierite, Corundum;
Softening Temperature: 1400;
Dulk Density: 650-860;
Cell Number: 13 Cell, 25 Cell, 40 Cell, 43 Cell, 50 Cell, 60 Cell;
Type: Honeycomb Ceramic Thermal Storage Media;
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Application: Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Alumina, Mullite, Cordierite, Corundum;
Water Absorption: 12-18;
Density: 2.1-2.41;
Cell Number: 13 Cell, 25 Cell, 40 Cell, 43 Cell, 50 Cell, 60 Cell;
Type: Honeycomb Ceramic Thermal Storage Media;
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Application: Industrial Ceramic, Rto/Rco & Heat Storage;
Material: Alumina, Mullite, Cordierite, Corundum;
Softening Temperature: 1700;
Dulk Density: 738-1103;
Cell Number: 13 Cell, 25 Cell, 40 Cell, 43 Cell, 50 Cell, 60 Cell;
Type: Honeycomb Ceramic Thermal Storage Media;
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