| Specification |
Type: Rigid Circuit Board;
Dielectric: CEM-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Hydrocarbon Resin;
Model: PCB;
Brand: Rogers;
Tihickness: 8mil, 10mil, 12mil, 20mil, 32mil and 60mil;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Copper Weight: 0.5oz, 1oz, 2oz;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Kb;
Copper Thickness: 1oz;
Layer: 2 Layer;
Solder Mask Color: Green;
Silkcreen Color: White;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.1mm;
Min. Line Space: 0.1mm;
Test: E-Test;
Package: Vacuum Package;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Model: PCB;
Solder Mask: White, Black, Red;
Silkscreen: White, Black, Red;
PCB Material Thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, 3.2mm;
Surface Finishing: HASL, Lf-Hal, Immerion Tin, Immerion Gold, OSP;
Min. Line Width: 0.1mm;
Min. Hole Size: 0.25mm;
Min. Line Spacing: 0.1mm;
Shipping: DHL, UPS, TNT, FedEx, etc;
Copper Thickness: 1oz;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Board Thickness: 1.6mm;
Surface Finishing: Immersion Gold;
Copper Thickness: 1oz;
Solder Mask Type: Green;
Silkscreen: White;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.2mm;
Min. Line Spacing: 0.2mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Insulation Materials: Metal Composite Materials;
Model: FR-4;
Brand: Kb;
Copper Thickness: 1oz;
Layer: 2 Layer;
Board Thickness: 1.6mm;
Solder Mask Type: Green;
Silkscreen: White;
Min.Hole Size: 0.2mm;
Min. Line Spacing: 0.1mm;
Min. Line Width: 0.1mm;
Test: E-Test;
Package: Vacuum Packing;
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