| Specification |
Type: Rigid Circuit Board;
Dielectric: RO4350B;
Material: RO4350B Laminate;
Application: Satellite Systems;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Silver;
Base Material: RO4350B Substrate;
Insulation Materials: RO4350B Substrate;
Brand: Rogers;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Selling Units: Single Item;
Min Drill Hole Diameter: 0.010.1mmor 10 Mil;
Number of Layers: 2/4/6/8/12/Custom;
Copper Thickness: 0.5-6.0oz;
Min Trace/Gap: 0.075mm Or3mil;
Silk Scre En Min Line Width: 0.006or0.15mm;
Board Size: Custom;
PCB Cutting: Shear V-Score, Tab-Routed;
Board Thickness: 0.2-4.0mm;
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Type: Smart Electronics PCBA;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Smart;
Layer: 1-24 Layers;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Min Linewidth/Linespacing: 0.075mm;
Min Hole Diameter: 0.15mm;
Min Solder Resist Bridge: 0.1mm;
Board Thickness: 0.2-4mm;
Mounting Component Pitch: 0.15mm;
|
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Selling Units: Single Item;
Min Drill Hole Diameter: 0.010.1mmor 10 Mil;
Number of Layers: 2/4/6/8/12/Custom;
Copper Thickness: 0.5-6.0oz;
Min Trace/Gap: 0.075mm Or3mil;
Silk Scre En Min Line Width: 0.006or0.15mm;
Board Size: Custom;
PCB Cutting: Shear V-Score, Tab-Routed;
Board Thickness: 0.2-4.0mm;
|
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Selling Units: Single Item;
Min Drill Hole Diameter: 0.010.1mmor 10 Mil;
Number of Layers: 2/4/6/8/12/Custom;
Copper Thickness: 0.5-6.0oz;
Min Trace/Gap: 0.075mm Or3mil;
Silk Scre En Min Line Width: 0.006or0.15mm;
Board Size: Custom;
PCB Cutting: Shear V-Score, Tab-Routed;
Board Thickness: 0.2-4.0mm;
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