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Electronic Components Price
US$0.90-99.99 / PCS
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What is Rogers Tmm10I Rigid PCB Board at Low Electronic Components Price

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 PCS US$99.99

100+ PCS US$0.90

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric Tmm10I
  • Material Ceramic Thermoset Polymer Composite
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Model PCB
  • Brand Rogers
  • Transport Package Kk Paper, 3-Layer Wrinkle
  • Specification 60mm x 70mm=1PCS, ± 0.15mm
  • Trademark Bicheng
  • Origin Shenzhen China
  • Surface Finish Immersion Gold
  • Board Thickness 0.6mm (Finished)
  • Layer Count 2-Layer
  • Solder Mask None

Product Description

2-Layer 0.6mm Rogers TMM10i Rigid PCB: Superior Choice for RF and Microwave Applications (All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.) 1. Overview of this type of PCB This 2-layer rigid PCB, featuring Rogers TMM10i laminate as ...

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Electronic Components Price Comparison
Transaction Info
Price US$0.90-99.99 / PCS US$1.00-4.00 / Piece US$1.00-4.00 / Piece US$1.00-4.00 / Piece US$1.00-4.00 / Piece
Min Order 1 PCS 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms Small-amount payment, Western Union, PayPal, D/P, T/T, LC LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Management System Certification - Others Others Others Others
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: Tmm10I;
Material: Ceramic Thermoset Polymer Composite;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Rogers;
Surface Finish: Immersion Gold;
Board Thickness: 0.6mm (Finished);
Layer Count: 2-Layer;
Solder Mask: None;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Custom: ODM/OEM/Cmt;
Packing: Standard Carton/ Vacuum/ Plastic;
Delivery: 7-15days Sample;
PCB Shape: Any Shape;
Layer: 1-32layer;
PCB Thickness: 0.3-0.4mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Inner Packing: Vacuum Packing;
Packing: Plastic Packing;
Outer Packing: Standard Carton Packing;
PCB Shape: Any Shape;
PCB Thickness: 0.3-0.4mm;
PCB Type: Rigid;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Placement Precision: Qfp;
Packing: Standard Carton Packing;
Custom: ODM/ OEM;
Layer: 1-36layer;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Custom: ODM/ OEM;
PCB Type: Rigid /Flexible/ Rigid-Flexible;
PCB Shape: Any Shape;
Outer Packing: Standard Carton Packing;
Inner Packing: Vacuum Packing;
Packing: Plastic Packing;
Supplier Name

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

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