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PCB Laminates
US$99.00 / PCS
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What is Rogers Rt/Duroid 5880 Laminates for High Frequency PCB, Stable 2.2 Dk

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 PCS US$99.00 / PCS

Sepcifications

  • Type Rigid Laminate
  • Dielectric PTFE-Based, Ceramic-Filled Fiberglass Substrate.
  • Material Rogers Rt/Duroid 5880 Laminates
  • Application Stripline
  • Processing Technology Bare Copper,Electrodeposited Copper
  • Base Material Microstrip and Stripline Circuits
  • Insulation Materials PTFE
  • Brand Rogers
  • Transport Package Normal Packaging
  • Specification 18" x 24"
  • Trademark bicheng
  • Origin Shenzhen China
  • Board Types Rigid Laminate
  • Test 100% Electrical Test Prior Shipment
  • Type of Artwork to Be Supplied Email File, Gerber RS-274-X, PCB.Doc etc
  • Service Area Worldwide, Globally

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.) Hello everyone, We'll introduce high-frequency printed circuit boards made with RT/duroid 5880 laminates. Overview of This Type of PCB RT/duroid 5880 is one of Rogers' glass ...

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PCB Laminates Comparison
Transaction Info
Price US$99.00 / PCS US$0.10-1.00 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
Min Order 1 PCS 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms Small-amount payment, Western Union, PayPal, D/P, T/T, LC LC, T/T, D/P, Western Union, PayPal, Small-amount payment T/T, Western Union T/T, Western Union T/T, Western Union
Quality Control
Management System Certification - - ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia Southeast Asia/ Mideast Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
Annual Export Revenue - - - - -
Business Model ODM, OEM Own Brand Own Brand, ODM Own Brand, ODM Own Brand, ODM
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Laminate;
Dielectric: PTFE-Based, Ceramic-Filled Fiberglass Substrate.;
Material: Rogers Rt/Duroid 5880 Laminates;
Application: Stripline;
Processing Technology: Bare Copper,Electrodeposited Copper;
Base Material: Microstrip and Stripline Circuits;
Insulation Materials: PTFE;
Brand: Rogers;
Board Types: Rigid Laminate;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper Substrate PCB;
Insulation Materials: Organic Resin;
Brand: Cry;
Base Material 1: MCPCB;
Base Material Thickness: 0.8mm-4.0mm;
Min. Hole Diameter: 0.25mm;
Min. Line Spacing: 0.2mm;
Testing Service: 100% Aoi Testing;
Color: Red Blue Green Black White;
Surface Finishing: Enig, HASL, OSP;
MOQ: 1PCS;
Product Type: Metal Core PCB;
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Application: New Energy Vehicle Electronic Control Board;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: T2 High Conductivity Copper(1.6mm);
Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
Copper Foil: 70μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Application: New Energy Vehicle Electronic Control Board;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: T2 High Conductivity Copper(1.6mm);
Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
Copper Foil: 70μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Application: New Energy Vehicle Electronic Control Board;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: T2 High Conductivity Copper(1.6mm);
Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
Copper Foil: 70μm;
Tg: 150°C;
Supplier Name

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Chengruyuan Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

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