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Electronic PCB
US$0.90-99.99 / Piece
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What is High-Frequency 2-Layer Tmm3 electronic PCB with 94V0 for RF Applications

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.90-99.99 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric Ceramic Thermoset Polymer Composite
  • Material Rogers Tmm 3 Laminate
  • Application RF/Microwave Circuits
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology HASL
  • Base Material Rogers Tmm 3 Laminate
  • Insulation Materials Tmm 3 Thermoset Composite
  • Brand Rogers
  • Transport Package Shipping Vacuum Packaging
  • Specification 155.1× 168.12mm ± 0.15mm
  • Trademark bicheng
  • Origin Shenzhen China
  • Board Types Rigid PCB
  • Test 100% Electrical Test Prior Shipment
  • Type of Artwork to Be Supplied Email File, Gerber RS-274-X, PCB.Doc etc
  • Service Area Worldwide, Globally

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.) Overview of This Type of PCB The 2-layer TMM3 PCB is a specialized microwave circuit board designed for high-reliability RF applications. Featuring Rogers' TMM3 ceramic thermoset polymer ...

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Electronic PCB Comparison
Transaction Info
Price US$0.90-99.99 / Piece US$3.00-10.00 / Piece US$3.00-10.00 / Piece US$3.00-10.00 / Piece US$3.00-10.00 / Piece
Min Order 1 Piece 5 Pieces 5 Pieces 5 Pieces 5 Pieces
Payment Terms Small-amount payment, Western Union, PayPal, D/P, T/T, LC LC, T/T, PayPal LC, T/T, PayPal LC, T/T, PayPal LC, T/T, PayPal
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: Ceramic Thermoset Polymer Composite;
Material: Rogers Tmm 3 Laminate;
Application: RF/Microwave Circuits;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: HASL;
Base Material: Rogers Tmm 3 Laminate;
Insulation Materials: Tmm 3 Thermoset Composite;
Brand: Rogers;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable;
Layer: 1-32;
Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
Max Production Size: 600*800mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable;
Layer: 1-32;
Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
Max Production Size: 600*800mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable;
Layer: 1-32;
Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
Max Production Size: 600*800mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable;
Layer: 1-32;
Outline Profile: Rout/ V-Cut Bridge/ Stamp Hole;
Max Production Size: 600*800mm;
Supplier Name

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shanghai Jumptop Trading Co Ltd

Gold Member Audited Supplier

Shanghai Jumptop Trading Co Ltd

Gold Member Audited Supplier

Shanghai Jumptop Trading Co Ltd

Gold Member Audited Supplier

Shanghai Jumptop Trading Co Ltd

Gold Member Audited Supplier

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