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Circuit Board
US$0.90-99.99 / Piece
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What is 6-Layer HDI Circuit Board Via in Pad PCB for GPS Tracking Applications

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.90-99.99 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric Fr-4 with Tg of 135°c
  • Material Fr-4 (Glass Epoxy From Iteq)
  • Application Bluetooth Transmitters
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Immersion Gold (32.1% ) 0.05μm Over 3
  • Base Material Fr-4 Substrate with Via in Pad Technology
  • Insulation Materials Tg135°c Fr-4
  • Brand Iteq
  • Transport Package Express Boxed
  • Specification 150 mm x 141 mm (1 piece)
  • Trademark bicheng
  • Origin Shenzhen China
  • Board Types Rigid PCB
  • Test 100% Electrical Test Prior Shipment
  • Type of Artwork to Be Supplied Email File, Gerber RS-274-X, PCB.Doc etc
  • Service Area Worldwide, Globally

Product Description

(Custom PCBs are tailored products; the images and specifications provided are for reference only.) General Description A 6-layer ultrathin printed circuit board (PCB) is built on an FR-4 substrate with a Tg of 135°C, specifically designed for GPS tracking applications. With a thickness of ...

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Circuit Board Comparison
Transaction Info
Price US$0.90-99.99 / Piece US$3.26-8.75 / Piece US$0.87-5.00 / Piece US$0.10 / PCS US$0.80-1.00 / Piece
Min Order 1 Piece 10 Pieces 10 Pieces 1 PCS 1 Piece
Payment Terms Small-amount payment, Western Union, PayPal, D/P, T/T, LC T/T T/T LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union
Quality Control
Product Certification - RoHS, CCC, ISO RoHS, CCC, ISO - -
Management System Certification - ISO9001:2015 ISO9001:2015 - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia Domestic Domestic North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM ODM, OEM ODM, OEM - -
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: Fr-4 with Tg of 135°c;
Material: Fr-4 (Glass Epoxy From Iteq);
Application: Bluetooth Transmitters;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold (32.1% ) 0.05µm Over 3;
Base Material: Fr-4 Substrate with Via in Pad Technology;
Insulation Materials: Tg135°c Fr-4;
Brand: Iteq;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Rigid Circuit Board;
Dielectric: AIN;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Uc;
Surface Finihsing: HASL-Lf;
Board Layer: 2 Layers;
Lead Time: 6 Working Days;
Color: White;
Type: Rigid Circuit Board;
Dielectric: Rogers;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer: 4 Layers;
Thickness: 1.62mm;
Mmodel: Xceh;
Rogers: R04003;
Supplier Name

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

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